The function
of the wafer stack splitter is to automatically separate single
wafers from the sawn stack. The sawn and pre-cleaned stack is
separated manually into short stacks before loading into the
ecoSplit®I for safe and fast single wafer separation. After
separating the single wafers are lined up for simultaneous inline
transfer to the cleaner module interface automatically. A sprinkler
system is used throughout the system to prevent the wafers from
drying out during the entire process.
The
Technology
The splitter
uses a gentle ‘dealing’ technique to separate wafers
from the bottom of the stack. This patented handling technology
has been carefully researched, developed and proven to provide
a fast, safe and stress-free method of separation which is unique
without prior knowledge of the handling materials and precise
control techniques.
